BE Semiconductor — advanced chip packaging/hybrid bonding tools
“The potential SiC (Silicon Carbide) Interposer bottleneck stack for $NVDA Rubin and Hyperscaler ASICs (if you didn't like $WOLF): Downstream SiC: $TSM - SiC for CoWoS interposers $AMKR - S-SWIFT packaging for SiC integration $ASX- VIPack platform and optical integration. SiC Midstream: $KLAC - SiC defect inspection $ONTO - Panel-level packaging + inspection $AMAT - SiC deposition $AEHR - SiC in…” post →
| Date | Tweet |
|---|---|
| 2026-01-24 | The potential SiC (Silicon Carbide) Interposer bottleneck stack for $NVDA Rubin and Hyperscaler ASICs (if you didn't like $WOLF): Downstream SiC: $TSM - SiC for CoWoS interposers $AMKR - S-SWIFT packaging for SiC integration $ASX- VIPack platform and optical integration. SiC Midstream: $KLAC - Si… → · 231 likes · 83,464 views |
from2028 — cross-site stock view. Rebuilt at publish time.